1119289645 3D IC And RF Sips; Advanced Stacking And Planar Solutions For 5G Mobility

3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility  eBooks & eLearning

Posted by roxul at April 11, 2018
3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

Lih-Tyng Hwang and Jason Tzyy-Sh Horng, "3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility"
English | ISBN: 1119289645 | 2018 | 440 pages | PDF | 11 MB