Advanced Mems Packaging (electronic Engineering) (repost)

Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing (Repost)

Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing By Sheng Liu, Yong Liu(auth.)
2011 | 566 Pages | ISBN: 0470827807 | PDF | 18 MB

RF and Microwave Microelectronics Packaging II (Repost)  eBooks & eLearning

Posted by AvaxGenius at June 7, 2022
RF and Microwave Microelectronics Packaging II (Repost)

RF and Microwave Microelectronics Packaging II by Ken Kuang
English | EPUB | 2017 | 186 Pages | ISBN : 3319516965 | 3.7 MB

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS.