Electrical Design of Through Silicon Via

Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity, and even thermal integrity. Most of the analysis in this book include simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have been studied deep into a TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.

This book presents some recent representative achievements in the field of surface science, including synthesis techniques, surface modifications, nanoparticle-based smart coatings, wettability of different surfaces, physics/chemistry characterizations, and growth kinetics of thin films.

Cadence Design Systems, Inc. , the leader in global electronic design innovation, is pleased to announce the availability hotfix 1 of Cadence Allegro and OrCAD 2022 (22.10.000) families of products aimed at boosting performance and productivity through improvements features and big fixed issues.

Cadence Design Systems, Inc. , the leader in global electronic design innovation, is pleased to announce the availability hotfix 1 of Cadence Allegro and OrCAD 2022 (22.10.000) families of products aimed at boosting performance and productivity through improvements features and big fixed issues.

The SSV Release Team has unveiled the Cadence Silicon Signoff and Verification (SSV) 22.10.000. This solution encapsulates a set of tools that address a series of electrical and physical signoff and verification steps that designers must perform on their design before tapeout.

Mentor Graphics has presented IE3D 15.0, is the first SCALABLE EM design and verification platform that delivers the modeling accuracy for the combined needs of high-frequency circuit design and signal integrity engineers across multiple design domains.