Integration of Modbus Devices Into Cip

Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to:

This volume LNCS 12735 constitutes the papers of the 18th International Conference on the Integration of Constraint Programming, Artificial Intelligence, and Operations Research, CPAIOR 2021, which was held in Vienna, Austria, in 2021. Due to the COVID-19 pandemic the conference was held online.

To paraphrase a popular saying, usability testing should be done early and often.

The book aims to integrate the aspects of IoT, Cloud computing and data analytics from diversified perspectives. The book also plans to discuss the recent research trends and advanced topics in the field which will be of interest to academicians and researchers working in this area. Thus, the book intends to help its readers to understand and explore the spectrum of applications of IoT, cloud computing and data analytics.