3D Microelectronic Packaging: From Fundamentals to Applications (Springer Series in Advanced Microelectronics) by Yan Li
English | 8 Feb. 2017 | ISBN: 3319445847 | 476 Pages | PDF | 20.87 MB
This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging,