RF Mems Switches For Configurable RF Devices

The book presents high quality papers presented at 2nd International Conference on Intelligent Computing, Communication & Devices (ICCD 2016) organized by Interscience Institute of Management and Technology (IIMT), Bhubaneswar, Odisha, India, during 13 and 14 August, 2016.

The book presents high quality papers presented at 2nd International Conference on Intelligent Computing, Communication & Devices (ICCD 2016) organized by Interscience Institute of Management and Technology (IIMT), Bhubaneswar, Odisha, India, during 13 and 14 August, 2016. The book covers all dimensions of intelligent sciences in its three tracks, namely, intelligent computing, intelligent communication and intelligent devices.

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS.

The book presents high quality papers presented at 2nd International Conference on Intelligent Computing, Communication & Devices (ICCD 2016) organized by Interscience Institute of Management and Technology (IIMT), Bhubaneswar, Odisha, India, during 13 and 14 August, 2016. The book covers all dimensions of intelligent sciences in its three tracks, namely, intelligent computing, intelligent communication and intelligent devices.

This book is about the advances of microelectromechanical systems (MEMS) and devices, the creation of new fields of research and development: bioMEMS, actuators, microfluidic devices, RF and optical MEMS. Experience indicates a need for MEMS book covering these materials as well as the most important process steps in bulk micro-machining and modeling.