RF And Microwave Measurements: Device Characterization, Signal Integrity And Spectrum Analysis

This book describes a fast, accurate and flexible modelling methodology for PCBs. The model uses the concept of tensorial analysis of networks (TAN) based on Kron's and Kron-Branin's methods adapted for the EMC use by O.Maurice. The TAN approach is applied to the PCB SI and electromagnetic compatibility (EMC) analysis.

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS.