Fastfood Packaging

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS.

This book provides valuable information on a range of food packaging topics. It serves as a source for students, professionals and packaging engineers who need to know more about the characteristics, applications and consequences of different packaging materials in food-packaging interactions.

This volume delivers a systematic overview of nanotechnology in the development of edible food packaging with noteworthy characteristics for improved food quality. It covers current research trends, history outlines, and state of the global marketin combination with associated biomaterials and synthesis strategies.

This volume delivers a systematic overview of nanotechnology in the development of edible food packaging with noteworthy characteristics for improved food quality. It covers current research trends, history outlines, and state of the global marketin combination with associated biomaterials and synthesis strategies.

A complete guide to the principles and practical application of modified atmosphere packaging
Modified atmosphere packaging (MAP) is one of the most cost-effective, versatile, and commonly used methods of preserving food products available today. Employed in both ambient and chilled conditions, it can prolong shelf-life and preserve the quality of a wide array of items via careful processes of atmospheric engineering. The essential scientific principles underlying this technology can, however, be difficult to grasp and effectively apply.

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.