Integrated me Design

Design for Manufacturability and Statistical Design: A Constructive Approach provides a thorough treatment of the causes of variability, methods for statistical data characterization, and techniques for modeling, analysis, and optimization of integrated circuits to improve yield.

This monograph focuses on control methods that influence vehicle dynamics to assist the driver in enhancing passenger comfort, road holding, efficiency and safety of transport, etc., while maintaining the driver’s ability to override that assistance

The development of computing machines found great success in the last decades. But the ongoing miniaturization of integrated circuits will reach its limits in the near future. Shrinking transistor sizes and power dissipation are the major barriers in the development of smaller and more powerful circuits.

Although existing nanometer CMOS technology is expected to remain dominant for the next decade, new non-classical devices are being developed as the potential replacements of silicon CMOS, in order to meet the ever-present demand for faster, smaller, more efficient integrate circuits.

This book enables readers to design effective ESD protection solutions for all mainstream RF fabrication processes (GaAs pHEMT, SiGe HBT, CMOS). The new techniques introduced by the authors have much higher protection levels and much lower parasitic effects than those of existing ESD protection devices.

The history of this book begins way back in 1982. At that time a research proposal was filed with the Dutch Foundation for Fundamental Research on Matter concerning research to model defects in the layer structure of integrated circuits. It was projected that the results may be useful for yield estimates, fault statistics and for the design of fault tolerant structures. The reviewers were not in favor of this proposal and it disappeared in the drawers.

Extreme Statistics in Nanoscale Memory Design brings together some of the world’s leading experts in statistical EDA, memory design, device variability modeling and reliability modeling, to compile theoretical and practical results in one complete reference on statistical techniques for extreme statistics in nanoscale memories.

With the semiconductor market growth, new Integrated Circuit designs are pushing the limit of the technology and in some cases, require specific fine-tuning of certain process modules in manufacturing.

Fine pitch high lead count integrated circuit packages represent a dramatic change from the conventional methods of assembling electronic components to a printed interconnect circuit board. To some, these FPTpackages appear to bean extension of the assembly technology called surface mount or SMT.