rf 101c

RAHRF101 is a quick start to the basic RF topic and the prerequisite for Rahsoft RF Certificate

Preparing for Apple, Broadcom, Qualcomm , Skyworks and other RF interviews

Achieve higher levels of performance, integration, compactness, and cost-effectiveness in the design and modeling of radio-frequency (RF) power amplifiersRF power amplifiers are important components of any wireless transmitter, but are often the limiting factors in achieving better performance and lower cost in a wireless communication system—presenting the RF IC design community with many challenges.

Achieve higher levels of performance, integration, compactness, and cost-effectiveness in the design and modeling of radio-frequency (RF) power amplifiersRF power amplifiers are important components of any wireless transmitter, but are often the limiting factors in achieving better performance and lower cost in a wireless communication system—presenting the RF IC design community with many challenges.

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

Wireless communication systems are persistently applying wider bandwidths, larger signal dynamics and higher carrier frequencies to fulfil the demand for higher data rates. This results in an ever increasing demand on the performance of low-cost and power-efficient radio frequency (RF) front-ends. Since the RF technology is, consequently, pushed to its operation boundaries, the intrinsic imperfections of the RF IC technology are more and more governing the system performance of wireless modems.

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS.

This book mainly focuses on the experimental research of rf breakdown and field emission with novel methods, including triggering rf breakdown with high intensity laser and pin-shaped cathodes as well as locating field emitters with a high resolution in-situ imaging system. With these methods, this book has analyzed the power flow between cells during rf breakdown, observed the evolution of field emission during rf conditioning and the dependence of field emission on stored energy, and studied the field emitter distribution and origination.