Microelectronic

This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.

This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.

This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.

This book guides readers through the entire complex of interrelated theoretical and practical aspects of the end-to-end design and organization of production of silicon submicron integrated circuits. The discussion includes the theoretical foundations of the operation of field-effect- and bipolar transistors, the methods and peculiarities of the structural and schematic design, basic circuit-design and system-design engineering solutions for bipolar, CMOS, BiCMOS and TTL integrated circuits, standard design libraries, and typical design flows.

Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement technologies that allow for in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests.