Microwave Processing of Materials

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS.

The main objective of this book was to collect as many different state-of-the-art studies as possible in order to cover in a single volume the main aspects of microwave systems and applications.

This book represents the first ever scientific monograph including an in-depth analysis of all major field-assisted sintering techniques. Until now, the electromagnetic field-assisted technologies of materials processing were lacking a systematic and generalized description in one fundamental publication; this work promotes the development of generalized concepts and of comparative analyses in this emerging area of materials fabrication.

This book represents the first ever scientific monograph including an in-depth analysis of all major field-assisted sintering techniques. Until now, the electromagnetic field-assisted technologies of materials processing were lacking a systematic and generalized description in one fundamental publication; this work promotes the development of generalized concepts and of comparative analyses in this emerging area of materials fabrication.