Semiconductor Packaging: Materials Interaction and Reliability by Andrea Chen and Randy Hsiao-Yu Lo
English | ISBN: 1439862052 | 2011 | 216 pages | PDF | 7,5 MB
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package.