Through Silicon Vias For 3D Integration
Electrical Modeling and Design for 3D System Integration eBooks & eLearning
Posted by arundhati at April 5, 2019
Er-Ping Li, "Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC"
2013 | ISBN-10: 0470623462 | 384 pages | PDF | 4 MB
2013 | ISBN-10: 0470623462 | 384 pages | PDF | 4 MB
Arbitrary Modeling of TSVs for 3D Integrated Circuits eBooks & eLearning
Posted by DZ123 at Oct. 10, 2019
Khaled Salah, Yehea Ismail, Alaa El-Rouby, "Arbitrary Modeling of TSVs for 3D Integrated Circuits"
English | 2014 | ISBN: 3319076108 | PDF | pages: 181 | 11.8 mb
English | 2014 | ISBN: 3319076108 | PDF | pages: 181 | 11.8 mb
Arbitrary Modeling of TSVs for 3D Integrated Circuits eBooks & eLearning
Posted by interes at Oct. 10, 2019
Arbitrary Modeling of TSVs for 3D Integrated Circuits (Analog Circuits and Signal Processing) by Khaled Salah and Yehea Ismail
English | 2014 | ISBN: 3319076108, 3319374974 | 179 pages | PDF | 11,7 MB
English | 2014 | ISBN: 3319076108, 3319374974 | 179 pages | PDF | 11,7 MB
Arbitrary Modeling of TSVs for 3D Integrated Circuits (Repost) eBooks & eLearning
Posted by AvaxGenius at Feb. 21, 2025
Arbitrary Modeling of TSVs for 3D Integrated Circuits by Khaled Salah , Yehea Ismail , Alaa El-Rouby
English | PDF (True) | 2015 | 181 Pages | ISBN : 3319076108 | 11.7 MB
This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.
Design of 3D Integrated Circuits and Systems eBooks & eLearning
Posted by insetes at March 25, 2022
Design of 3D Integrated Circuits and Systems By Rohit Sharma
2014 | 302 Pages | ISBN: 146658940X | PDF | 6 MB
2014 | 302 Pages | ISBN: 146658940X | PDF | 6 MB
Carbon Nanotubes for Interconnects: Process, Design and Applications eBooks & eLearning
Posted by hill0 at Jan. 15, 2018
Carbon Nanotubes for Interconnects: Process, Design and Applications by Aida Todri-Sanial
English | 28 July 2016 | ISBN: 3319297449 | 348 Pages | EPUB | 8.07 MB
English | 28 July 2016 | ISBN: 3319297449 | 348 Pages | EPUB | 8.07 MB
This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs,
Carbon Nanotubes for Interconnects: Process, Design and Applications (Repost) eBooks & eLearning
Posted by step778 at April 9, 2019
Aida Todri-Sanial, Jean Dijon, Antonio Maffucci, "Carbon Nanotubes for Interconnects: Process, Design and Applications"
2016 | pages: 340 | ISBN: 3319297449 | PDF | 12,6 mb
2016 | pages: 340 | ISBN: 3319297449 | PDF | 12,6 mb
Cadence Reality DC Design 2024.1 (x64) Software
Posted by Magictor at April 11, 2024
Cadence Reality DC Design 2024.1 (x64) | 3.3 GB
6SigmaRoom by Future Facilities Ltd. has been rebranded into two distinct product offerings from Cadence Design Systems: DataCenter Design and DataCenter Insight. See About DataCenter 2023.2 DataCenter Design and DataCenter Insight Desktop 2023.2 follow on directly from 6SigmaRoom Release 17.1,so all known and fixed issues that applied to 6SigmaRoom Release 17.1 also apply to DataCenter Design and DataCenter Insight Desktop 2023.2.
Cadence DataCenter Design 2023.2 (x64) Software
Posted by Magictor at July 12, 2023
Cadence DataCenter Design 2023.2 (x64) | 1.8 GB
6SigmaRoom by Future Facilities Ltd. has been rebranded into two distinct product offerings from Cadence Design Systems: DataCenter Design and DataCenter Insight. See About DataCenter 2023.2 DataCenter Design and DataCenter Insight Desktop 2023.2 follow on directly from 6SigmaRoom Release 17.1,so all known and fixed issues that applied to 6SigmaRoom Release 17.1 also apply to DataCenter Design and DataCenter Insight Desktop 2023.2.
Cadence DataCenter Design 2023.2 HF4 (x64) Software
Posted by Magictor at Feb. 26, 2024
Cadence DataCenter Design 2023.2 HF4 (x64) | 2.3 GB
6SigmaRoom by Future Facilities Ltd. has been rebranded into two distinct product offerings from Cadence Design Systems: DataCenter Design and DataCenter Insight. See About DataCenter 2023.2 DataCenter Design and DataCenter Insight Desktop 2023.2 follow on directly from 6SigmaRoom Release 17.1,so all known and fixed issues that applied to 6SigmaRoom Release 17.1 also apply to DataCenter Design and DataCenter Insight Desktop 2023.2.