Exchange Sp3

Tekla Structures 2017 SP3 Update  Software

Posted by scutter at July 2, 2017
Tekla Structures 2017 SP3 Update

Tekla Structures 2017 SP3 Update | 1.8 Gb

Trimble has released an update to new version of Building Information Modeling (BIM) — Tekla Structures 2017. Continuous development of Tekla Building Information Modeling (BIM) solutions demonstrates Trimble’s commitment to innovation in structural engineering, off-site prefabrication and on-site efficiency.

Cimatron 16 SP3  Software

Posted by scutter at July 22, 2023
Cimatron 16 SP3

Cimatron 16 SP3 | 2.5 Gb

Cimatron, the leading CAD/CAM software supplier for the mold & die industry, have announced the release of their Mold & Die focused product Cimatron E16 SP3. Version 16 of Cimatron’s CAD/CAM software is a substantial release introducing many new features in all areas of the product including a clean new UI and increased automation for faster mould design, electrode creation, and NC programming.

Microsoft Exchange Server 2016 CU15  Software

Posted by scutter at Dec. 21, 2019
Microsoft Exchange Server 2016 CU15

Microsoft Exchange Server 2016 CU15 | 2.2 Gb

The Microsoft team is pleased to announce the availability of Cumulative Update 15 to Exchange Server 2016. This cumulative update includes fixes for nonsecurity issues and all previously released fixes for security and nonsecurity issues.

Microsoft Exchange Server 2016 CU14  Software

Posted by scutter at Sept. 19, 2019
Microsoft Exchange Server 2016 CU14

Microsoft Exchange Server 2016 CU14 | 2.2 Gb

The Microsoft team is pleased to announce the availability of Cumulative Update 14 to Exchange Server 2016. This cumulative update includes fixes for nonsecurity issues and all previously released fixes for security and nonsecurity issues.

Copper-Catalyzed Electrophilic Amination of sp2 and sp3 C−H Bonds (Repost)  eBooks & eLearning

Posted by DZ123 at April 17, 2020
Copper-Catalyzed Electrophilic Amination of sp2 and sp3 C−H Bonds (Repost)

Stacey L. McDonald, "Copper-Catalyzed Electrophilic Amination of sp2 and sp3 C−H Bonds"
English | 2016 | ISBN: 3319388770 | PDF | pages: 162 | 7.1 mb

Copper-Catalyzed Electrophilic Amination of sp2 and sp3 C-H Bonds [repost]  eBooks & eLearning

Posted by naag at May 8, 2017
Copper-Catalyzed Electrophilic Amination of sp2 and sp3 C-H Bonds [repost]

Copper-Catalyzed Electrophilic Amination of sp2 and sp3 C-H Bonds (Springer Theses) by Stacey L. McDonald
2016 | ISBN: 3319388770 | English | 144 pages | PDF | 7 MB

ZWSIM MeshWorks 2022 SP3 (x64) Multilingual  Software

Posted by melt_ at Aug. 25, 2022
ZWSIM MeshWorks 2022 SP3 (x64) Multilingual

ZWSIM MeshWorks 2022 SP3 (x64) Multilingual | 1.41 GB

ZWMeshWorks is a CAE platform with ready-made pre- and post- processors for developers to integrate solvers. Based on the self-developed modeling kernel and meshing techniques, it satisfies your needs from pre-processing, solving to post-processing, and significantly improves your development efficiency.

ZWSIM Structural 2022 SP3 (x64) Multilingual  Software

Posted by melt_ at Aug. 25, 2022
ZWSIM Structural 2022 SP3 (x64) Multilingual

ZWSIM Structural 2022 SP3 (x64) Multilingual | 1.43 GB

ZWSim Structural is a structural finite element simulation analysis system that integrates modeling and simulation. It can provide users with simulation results that meet the requirements of engineering accuracy. The performance of the design model can be evaluated through the structural simulation. It is committed to helping companies optimize design, reduce test investment and shorten development cycle. ZWSim Structural 2022 supports the static, dynamic and heat transfer problems of structural. And it can calculate the displacement, stress, strain, velocity, acceleration, buckling factor, natural frequency, temperature distribution, heat flow, etc.

Proteus Professional v8.16 SP3 Build 36097  Software

Posted by envasel at Oct. 8, 2023
Proteus Professional v8.16 SP3 Build 36097

Proteus Professional v8.16 SP3 Build 36097 | 661 MB

Proteus Professional is a software package for computer-aided design of electronic circuits. The package is a circuit modeling system based on models of electronic components adopted in PSpice.

Microsoft Windows Powershell: Step By Step with MS Exchange :: 2020  eBooks & eLearning

Posted by AvaxKevin at Nov. 4, 2020
Microsoft Windows Powershell: Step By Step with MS Exchange :: 2020


Microsoft Windows Powershell: Step By Step with MS Exchange :: 2020 by SACHIN Srivastava
English | 2020 | ASIN: B08MLNBP67 | 357 Pages | PDF/EPUB/AZW3/MOBi | 15.6 MB