Failure Analysis Semiconductor

ESD Design and Analysis Handbook presents an overview of ESD as it effects electronic circuits and provides a concise introduction for students, engineers, circuit designers and failure analysts. This handbook is written in simple terms and is filled with practical advice and examples to illustrate the concepts presented.While this treatment is not exhaustive, it presents many of the most important areas of the ESD problem and suggests methods for improving them. The key topics covered include the physics of the event, failure analysis, protection, characterization, and simulation techniques. The book is intended as both an introductory text on ESD and a useful reference tool to draw on as the reader gains experience. The authors have tried to balance the level of detail in the ESD Design and Analysis Handbook against the wealth of literature published on ESD every year. To that end, each chapter has a topical list of references to facilitate further in-depth study.

This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints.

This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints.

This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints.

Part 7: Semiconductor Reliability and Failure Analysis

Electrostatic discharge (ESD) failure mechanisms continue to impact semiconductor components and systems as technologies scale from micro- to nano-electronics.