Failure Analysis

Failure Analysis, NDA/EFA/PFA, IC/Foundry, FA house, Semiconductor Device/MOSFET/CMOS

Failure Analysis, NDA/EFA/PFA, IC/Foundry, FA house, Semiconductor Device/MOSFET/CMOS

This volume is dedicated to strengths and limitations of traditional theoretical approaches to fiber reinforced plastic (FRP) laminate design against failure; stress corrosion cracking behavior of materials; failure analysis and durability issues.

Provides the knowledge and failure analysis skills necessary for preventing and investigating process equipment failures
Process equipment and piping systems are essential for plant availability and performance. Regularly exposed to hazardous service conditions and damage mechanisms, these critical plant assets can result in major failures if not effectively monitored and assessed—potentially causing serious injuries and significant business losses. When used proactively, Root Cause Failure Analysis (RCFA) helps reliability engineers inspect the process equipment and piping system before any abnormal conditions occur. RCFA is equally important after a failure happens: it determines the impact of a failure, helps control the resultant damage, and identifies the steps for preventing future problems.

This book covers recent advancement methods used in analysing the root cause of engineering failures and the proactive suggestion for future failure prevention. The techniques used especially non-destructive testing such X-ray are well described. The failure analysis covers materials for metal and composites for various applications in mechanical, civil and electrical applications.

Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes.