3D Stacked Chips: From Emerging Processes to Heterogeneous Systems
Springer | Circuits & Systems | June 12, 2016 | ISBN-10: 3319204807 | 339 pages | pdf | 16.3 mb
Editors: Elfadel, Ibrahim (Abe) M., Fettweis, Gerhard (Eds.)
Provides single-source reference to the latest research in 3D optoelectronic integration: process, devices, and systems;
Explains the use of wireless 3D integration to improve 3D IC reliability and yield;
Describes techniques for monitoring and mitigating thermal behavior in 3D ICs;
Includes discussion of 3D integration of high-density power sources and novel NVM