High Speed

Master Compressible Flow Fundamentals : High-Speed Gas Dynamics & Thermodynamics - Unlock Secrets of Compressible Flows

Digital fringe protection (DFP) techniques are used for non-contact shape measurement of 3D images. In the rapidly expanding field of 3D high-speed imaging, the demand for DFP continues to grow due to the technology’s fast speed, flexibility, low cost, and high accuracy.

by Doyle D. Knight (Author)
Written by a leading expert in the field, this book presents a novel method for controlling high-speed flows past aerodynamic shapes using energy deposition via direct current (DC), laser or microwave discharge, and describes selected applications in supersonic and hypersonic flows

This book is a step-by-step tutorial on how to design a low-power, high-resolution (not less than 12 bit), and high-speed (not less than 200 MSps) integrated CMOS analog-to-digital (AD) converter, to respond to the challenge from the rapid growth of IoT. The discussion includes design techniques on both the system level and the circuit block level.

The appropriate interconnect model has changed several times over the past two decades due to the application of aggressive technology scaling. New, more accurate interconnect models are required to manage the changing physical characteristics of integrated circuits. Currently, RC models are used to analyze high resistance nets while capacitive models are used for less resistive interconnect. However, on-chip inductance is becoming more important with integrated circuits operating at higher frequencies, since the inductive impedance is proportional to the frequency. The operating frequencies of integrated circuits have increased dramatically over the past decade and are expected to maintain the same rate of increase over the next decade, approaching 10 GHz by the year 2012. Also, wide wires are frequently encountered in important global nets, such as clock distribution networks and in upper metal layers, and performance requirements are pushing the introduction of new materials for low resistance interconnect, such as copper interconnect already used in many commercial CMOS technologies.

In the first decade of the 21st century product development in networks was predicted to be of ever-increasing importance to businesses of all sizes because of changes in markets, in technology, in networks, and in the competences of Businesses. The growth in new products' share of businesses' total turnover and earnings were increasing at an unprecedented speed.