Integrated Circuit Failure Analysis

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics.

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics.

ANSYS Inc. has announced the availability of the 2021 R1 edition of its ANSYS Electronics Suite of electronics and electromagnetics simulation software solutions.

ANSYS Inc. has announced the availability of the 2021 R1 edition of its ANSYS Electronics Suite of electronics and electromagnetics simulation software solutions.

Cadence Design Systems, Inc., the leader in global electronic design innovation, announced the availability of the update (IC6.1.6 ISR8) to its next-generation Cadence Virtuoso custom IC design platform. Cadence continues to provide a complete solution enabling customers to design custom integrated circuits reliably and with a high level of productivity.

The Ansys development team is pleased to announce the availability of Ansys Products 2021 R1, a comprehensive software suite that spans the entire range of physics, providing access to virtually any field of engineering simulation that a design process requires.

Cadence Design Systems, Inc. has launched Cadence IC6.1.7 ISR22 Virtuoso, a formal, streamlined and automated co-design and verification flow between the Cadence Virtuoso platform and Allegro and Sigrity technologies. This higher level of integration enables engineers to design concurrently across the chip, package and board.

Downstream has announced new versions of their industry-leading PCB post-processing solutions CAM350 and BluePrint-PCB. The new releases, CAM350 version 15.1 (2142) and BluePrint-PCB version 7.1 (2142) includes new functionalitys and defect fixes to various user-reported issues from the previous release.