Mechatronic Modeling of Realtime Wheelrail Contact

Modeling of Dynamic Systems with Engineering Applications  eBooks & eLearning

Posted by ksveta6 at Feb. 4, 2018
Modeling of Dynamic Systems with Engineering Applications

Modeling of Dynamic Systems with Engineering Applications by Clarence W. de Silva
2017 | ISBN: 1498798489 | English | 691 pages | PDF | 25 MB

Binary Divinity - The Modeling of Chaos by Kostas Y.Macfarlane  eBooks & eLearning

Posted by Alexpal at March 30, 2013
Binary Divinity - The Modeling of Chaos by Kostas Y.Macfarlane

Binary Divinity - The Modeling of Chaos by Kostas Y.Macfarlane
English | 20h 55 m | AVC1 1024x640 10 fps | AAC 64 Kbps 44.1 KHz | 5.07 GB
Genre: eLearning

This is a 20+ hours realtime video tutorial covering concept, modeling, texturing, sculpting, materials, lighting, rendering and post - the whole process from start to finish. The lessons show the progress from cube to fully textured, sculpted, rendered head. This tutorial takes you through the modeling and texturing of Chaos using 3ds MAX, ZBrush and Photoshop.

The Modeling of Chaos  Movies

Posted by Alexpal at Jan. 19, 2010
The Modeling of Chaos

The Modeling of Chaos | 5 GB
Instructor: Kostas Y. Macfarlane | TRT: 20h 55m

- This is a 20+ hours realtime video tutorial covering concept, modeling, texturing, sculpting, materials, lighting, rendering and post - the whole process from start to finish.
- Applications used: 3dsmax, zbrush, ps and mr

Multiscale Modeling of Electrochemical Reactions and Processes  eBooks & eLearning

Posted by Free butterfly at Dec. 13, 2024
Multiscale Modeling of Electrochemical Reactions and Processes

Multiscale Modeling of Electrochemical Reactions and Processes by Yun Wang
English | 2021 | ISBN: 0735422346 | 138 pages | PDF | 4.58 Mb

Arbitrary Modeling of TSVs for 3D Integrated Circuits (Repost)  eBooks & eLearning

Posted by AvaxGenius at Feb. 21, 2025
Arbitrary Modeling of TSVs for 3D Integrated Circuits (Repost)

Arbitrary Modeling of TSVs for 3D Integrated Circuits by Khaled Salah , Yehea Ismail , Alaa El-Rouby
English | PDF (True) | 2015 | 181 Pages | ISBN : 3319076108 | 11.7 MB

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.

Agent-Based Modeling of Environmental Conflict and Cooperation  eBooks & eLearning

Posted by Underaglassmoon at Dec. 4, 2018
Agent-Based Modeling of Environmental Conflict and Cooperation

Agent-Based Modeling of Environmental Conflict and Cooperation
CRC Press | English | 2019 | ISBN-10: 113847603X | 363 pages | PDF | 15.62 MB

by Todd K. BenDor (Author), Jürgen Scheffran (Author)
This book examines the recent development and use of computer modeling and simulation as an important tool for understanding environmental and resource-based conflicts and for finding pathways for conflict resolution and cooperation
Colored Petri Nets for Modeling of Discrete Systems: A Practical Approach With GPenSIM (Asset Analytics)

Colored Petri Nets for Modeling of Discrete Systems: A Practical Approach With GPenSIM (Asset Analytics) by Reggie Davidrajuh
English | November 5, 2023 | ISBN: 9819968585 | 239 pages | MOBI | 25 Mb
Multiscale and Multiphysics Modeling of Nuclear Facilities with Coupled Codes and its Uncertainty Quantification

Multiscale and Multiphysics Modeling of Nuclear Facilities with Coupled Codes and its Uncertainty Quantification and Sensitivity Analysis by Chunyu Liu
English | January 24, 2024 | ISBN: 365843421X | 216 pages | MOBI | 30 Mb

Arbitrary Modeling of TSVs for 3D Integrated Circuits  eBooks & eLearning

Posted by interes at Nov. 14, 2014
Arbitrary Modeling of TSVs for 3D Integrated Circuits

Arbitrary Modeling of TSVs for 3D Integrated Circuits (Analog Circuits and Signal Processing) by Khaled Salah and Yehea Ismail
English | 2014 | ISBN: 3319076108 | 179 pages | PDF | 11,7 MB

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects.

Arbitrary Modeling of TSVs for 3D Integrated Circuits  eBooks & eLearning

Posted by interes at Oct. 10, 2019
Arbitrary Modeling of TSVs for 3D Integrated Circuits

Arbitrary Modeling of TSVs for 3D Integrated Circuits (Analog Circuits and Signal Processing) by Khaled Salah and Yehea Ismail
English | 2014 | ISBN: 3319076108, 3319374974 | 179 pages | PDF | 11,7 MB