Microwave Materials

There are only few areas of research and development of a comparable scientific and technological extension as microwave and high frequency processing.

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS.

The main objective of this book was to collect as many different state-of-the-art studies as possible in order to cover in a single volume the main aspects of microwave systems and applications.