Wafer Level

Wafer-Level Testing and Test During Burn-In for Integrated Circuits eBooks & eLearning

Posted by nebulae at March 20, 2014

Sudarshan Bahukudumbi, Krishnendu Chakrabarty, "Wafer-Level Testing and Test During Burn-In for Integrated Circuits"
English | ISBN: 1596939893 | 2010 | 215 pages | PDF | 3 MB

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Wafer-Level Testing and Test During Burn-In for Integrated Circuits (Repost) eBooks & eLearning

Posted by nebulae at Oct. 28, 2017

Sudarshan Bahukudumbi, Krishnendu Chakrabarty, "Wafer-Level Testing and Test During Burn-In for Integrated Circuits"
English | ISBN: 1596939893 | 2010 | 215 pages | PDF | 3 MB

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Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications eBooks & eLearning

Posted by roxul at Nov. 16, 2014

Shichun Qu, Yong Liu, "Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications"
English | ISBN: 149391555X | 2015 | 342 pages | PDF | 19 MB

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Fan-Out Wafer-Level Packaging eBooks & eLearning

Posted by AvaxGenius at April 6, 2018

This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple’s iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community.

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Advances in Embedded and Fan-Out Wafer Level Packaging Technologies eBooks & eLearning

Posted by roxul at April 29, 2019

Beth Keser and Steffen Kroehnert, "Advances in Embedded and Fan-Out Wafer Level Packaging Technologies"
English | ISBN: 1119314135 | 2019 | 576 pages | PDF | 29 MB

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Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications eBooks & eLearning

Posted by DZ123 at Oct. 31, 2019

Shichun Qu, Yong Liu, "Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications"
English | 2014 | ISBN: 149391555X | PDF | pages: 336 | 19.3 mb

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Wafer Level 3-D ICs Process Technology (repost) eBooks & eLearning

Posted by tot167 at Dec. 20, 2010

Chuan Seng Tan, Ronald J. Gutmann, L. Rafael Reif, "Wafer Level 3-D ICs Process Technology"
Spri/nger | 2008 | ISBN: 0387765328 | 410 pages | PDF | 11,1 MB

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Wafer Level 3-D ICs Process Technology eBooks & eLearning

Posted by tot167 at July 1, 2009

Chuan Seng Tan, Ronald J. Gutmann, L. Rafael Reif, "Wafer Level 3-D ICs Process Technology"
Springer | 2008 | ISBN: 0387765328 | 410 pages | PDF | 11,1 MB

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Wafer Level 3-D ICS Process Technology [Repost] eBooks & eLearning

Posted by Free butterfly at Nov. 29, 2015

This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging.

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Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces eBooks & eLearning

Posted by yoyoloit at Dec. 7, 2021

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