Integrated Interconnect Technologies for 3D Nanoelectronic Systems
Artech House Publishers; 1 edition | November 2008 | ISBN-10: 1596932465 | 528 pages | PDF | 11.5 Mb
Today's microchips have nearly reached their performance limits. Various heat removal, power delivery, chip reliability, and input/output (I/O) signaling problems stand in the way of next-generation 3D gigascale, system-on-a-chip technology, and this cutting-edge guide describes the latest breakthroughs in microfluidics, high-density compliant electrical interconnects, and nanophotonics that are converging to solve them.