3d Interconnect

3D Interconnect Architectures for Heterogeneous Technologies  eBooks & eLearning

Posted by hill0 at June 28, 2022
3D Interconnect Architectures for Heterogeneous Technologies

3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization
English | 2022 | ISBN: 3030982289 | 403 Pages | PDF (True) | 11 MB

Integrated Interconnect Technologies for 3D Nanoelectronic Systems (repost)  eBooks & eLearning

Posted by sandhu1 at Nov. 27, 2011
Integrated Interconnect Technologies for 3D Nanoelectronic Systems (repost)

Integrated Interconnect Technologies for 3D Nanoelectronic Systems
Artech House Publishers; 1 edition | November 2008 | ISBN-10: 1596932465 | 528 pages | PDF | 11.5 Mb

Today's microchips have nearly reached their performance limits. Various heat removal, power delivery, chip reliability, and input/output (I/O) signaling problems stand in the way of next-generation 3D gigascale, system-on-a-chip technology, and this cutting-edge guide describes the latest breakthroughs in microfluidics, high-density compliant electrical interconnects, and nanophotonics that are converging to solve them.

Three-Dimensional Molded Interconnect Devices (3D-MID)  eBooks & eLearning

Posted by arundhati at Oct. 24, 2016
Three-Dimensional Molded Interconnect Devices (3D-MID)

Jörg Franke, "Three-Dimensional Molded Interconnect Devices (3D-MID): Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers"
2014 | ISBN-10: 1569905517 | 368 pages | PDF | 13 MB

Integrated Interconnect Technologies for 3D Nanoelectronic Systems (Repost)  eBooks & eLearning

Posted by insetes at Jan. 6, 2019
Integrated Interconnect Technologies for 3D Nanoelectronic Systems (Repost)

Integrated Interconnect Technologies for 3D Nanoelectronic Systems By Muhannad S. Bakir, James D. Meindl
2008 | 528 Pages | ISBN: 1596932465 | PDF | 13 MB

Integrated Interconnect Technologies for 3D Nanoelectronic Systems (repost)  eBooks & eLearning

Posted by fdts at Oct. 26, 2013
Integrated Interconnect Technologies for 3D Nanoelectronic Systems (repost)

Integrated Interconnect Technologies for 3D Nanoelectronic Systems
by Muhannad S. Bakir and James D. Meindl
English | 2008 | ISBN: 1596932465 | 528 pages | PDF | 12.81 MB
3D-MID: Three-Dimensional Molded Interconnect Devices: Materials, Manufacturing, Assembly and Applications for Injection

, "3D-MID: Three-Dimensional Molded Interconnect Devices: Materials, Manufacturing, Assembly and Applications for Injection"
English | ISBN: 1569905517 | 2014 | 356 pages | PDF | 13 MB

Cadence Sigrity 3D-EM version 19.00.000  Software

Posted by scutter at Dec. 3, 2019
Cadence Sigrity 3D-EM version 19.00.000

Cadence Sigrity 3D-EM version 19.00.000 | 2.2 Gb

Cadence Design Systems is pleased to announce the availability of Sigrity 3D-EM 2019 version 19.00.000. This release includes the 3D-EM engine and 3D Workbench executables that are not available in the Sigrity 2019 release media. This enables users of 3D-EM and 3D Workbench to use the 3D-EM and 3D Workbench executables from the Sigrity 2019 installation hierarchy.
Nano-Interconnect Materials and Models for Next Generation Integrated Circuit Design

Nano-Interconnect Materials and Models for Next Generation Integrated Circuit Design
English | 2024 | ISBN: 1032363819 | 223 Pages | PDF (True) | 21 MB

CAMWorks 2017 SP1.1  Software

Posted by scutter at May 23, 2017
CAMWorks 2017 SP1.1

CAMWorks 2017 SP1.1 | 2.0 Gb

Geometric has released CAMWorks 2017 SP1.1 with significant additions to the software focusing on customer needs and worldwide manufacturing initiatives, such as Smart Manufacturing and Industrie 4.0. The new capabilities in CAMWorks 2017 are a result of more than 60 customer-driven enhancements.

SolidWorks 2018 SP1.0  Software

Posted by scutter at Jan. 9, 2018
SolidWorks 2018 SP1.0

SolidWorks 2018 SP1.0 | 14.4 Gb

Dassault Systèmes has released an update to SOLIDWORKS 2018, the latest release of its portfolio of 3D design and engineering applications. SOLIDWORKS 2018 features an integrated, end-to-end solution for the design to manufacturing process that enables businesses of any size to rethink their approach to how parts and products are made and quickly bring innovative ideas to market in today’s experience economy.