Integrated Circuits

Analog Integrated Circuits for Communication: Principles, Simulation and Design, Second Edition covers the analysis and design of nonlinear analog integrated circuits that form the basis of present-day communication systems. Both bipolar and MOS transistor circuits are analyzed and several numerical examples are used to illustrate the analysis and design techniques developed in this book. Especially unique to this work is the tight coupling between the first-order circuit analysis and circuit simulation results. Extensive use has been made of the public domain circuit simulator Spice, to verify the results of first-order analyses, and for detailed simulations with complex device models.

This book offers the first comprehensive view on integrated circuit and system design for the Internet of Things (IoT), and in particular for the tiny nodes at its edge.

As information processing moves at a fast pace to small portable embedded devices, the information channels and endpoints need greater protection. Secure Integrated Circuits and Systems provides the integrated circuits designer and embedded system designer with insights into the basics of security and cryptography needed for such devices from an implementation perspective.

In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime.

Electrical overstress (EOS) and Electrostatic discharge (ESD) pose one of the most dominant threats to integrated circuits (ICs). These reliability concerns are becoming more serious with the downward scaling of device feature sizes. Modeling of Electrical Overstress in Integrated Circuits presents a comprehensive analysis of EOS/ESD-related failures in I/O protection devices in integrated circuits.

In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime.

Electrical overstress (EOS) and Electrostatic discharge (ESD) pose one of the most dominant threats to integrated circuits (ICs). These reliability concerns are becoming more serious with the downward scaling of device feature sizes. Modeling of Electrical Overstress in Integrated Circuits presents a comprehensive analysis of EOS/ESD-related failures in I/O protection devices in integrated circuits.