Integrated me Design

This book presents the state-of-the-art research in the field of transdisciplinary design, and highlights the challenges and issues from the perspectives of processes, people and products in transdisciplinary product design and development.

Formal Equivalence Checking and Design Debugging covers two major topics in design verification: logic equivalence checking and design debugging. The first part of the book reviews the design problems that require logic equivalence checking and describes the underlying technologies that are used to solve them. Some novel approaches to the problems of verifying design revisions after intensive sequential transformations such as retiming are described in detail.

This book gathers contributions presented at the International Joint Conference on Mechanics, Design Engineering and Advanced Manufacturing (JCM 2020), held as a web conference on June 2–4, 2020.

Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity, and even thermal integrity. Most of the analysis in this book include simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have been studied deep into a TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.

Power consumption of VLSI (Very Large Scale Integrated) circuits has been growing at an alarmingly rapid rate. This increase in power consumption, coupled with the increasing demand for portable/hand-held electronics, has made power consumption a dominant concern in the design of VLSI circuits today. Traditionally, dynamic (switching) power has dominated the total power consumption of an IC. However, due to current scaling trends, leakage power has now become a major component of the total power consumption in VLSI circuits. Leakage power reduction is especially important in portable/hand-held electronics such as cell-phones and PDAs.

This book presents emerging work in the co-evolving fields of design-led systemics, referred to as systemic design to distinguish it from the engineering and hard science epistemologies of system design or systems engineering. There are significant societal forces and organizational demands impelling the requirement for “better means of change” through integrated design practices of systems and services.

Design exibility and power consumption in addition to the cost, have always been the most important issues in design of integrated circuits (ICs), and are the main concerns of this research, as well. Energy Consumptions: Power dissipation (P ) and energy consumption are - diss pecially importantwhen there is a limited amountof power budgetor limited source of energy. Very common examples are portable systems where the battery life time depends on system power consumption.

Networked information technology (NIT) systems are synonymous with network-centric or net-centric systems and constitute the cornerstone of the fast approaching information age. To date, however, the design and development of NIT systems have been ad hoc and have suffered from a dearth of supporting scientific and theoretical principles.

Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results as well as original work by the authors. All major aspects of MCM physical design are discussed, including interconnect analysis and modeling, system partitioning and placement, and multilayer routing. For readers unfamiliar with MCMs, this book presents an overview of the different MCM technologies available today.