Signal Integrity

Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity, and even thermal integrity. Most of the analysis in this book include simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have been studied deep into a TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.

Cadence Design Systems, Inc., a leader in global electronic design innovation, is pleased to announce the availability of Sigrity and Systems Analysis 2024.1 HF002 is a supplier of software for IC package physical design and for analyzing power integrity and signal integrity.

Cadence Design Systems Ltd., a world-renowned provider of EDA software, announced OrCAD 16.6-2015. The OrCAD 16.6-2015 release celebrates the 30th anniversary of OrCAD and 30 years of continued investment and innovation of OrCAD technology.

Mentor Graphics, a technology leader in electronic design automation (EDA), has released VX.2 version of PADS Standart Plus is an easy-to-use, complete desktop design flow for PCB hardware engineers and layout designers requiring higher productivity.

Mentor Graphics has presented IE3D 15.0, is the first SCALABLE EM design and verification platform that delivers the modeling accuracy for the combined needs of high-frequency circuit design and signal integrity engineers across multiple design domains.