3d Interconnect

Dassault Systèmes announced the launch of SOLIDWORKS 2019, the latest release of its portfolio of 3D design and engineering applications. SOLIDWORKS 2019 delivers enhancements and new functionalities that help millions of innovators improve the product development process to get products into production faster, and create new categories of experiences for new categories of customers in today’s Industry Renaissance.

Editors: Todri-Sanial, Aida, Dijon, Jean, Maffucci, Antonio (Eds.)
Provides a single-source reference on carbon nanotubes for interconnect applications
Includes complete coverage of current Cu-based interconnect problems for both 2D and 3D interconnects
Covers topics from modeling, simulation, analysis, design and characterization, in order to provide a broad view of the application of carbon nanotubes for interconnects

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability.

Sigrity 2022 software for simulation and signal integrity in high-frequency circuits. With the advancement of digital processing technology, the need for faster processing has grown increasingly, Prdzashgrhayy that necessarily needs to work faster circuits with higher processing speeds and higher frequencies are located. By increasing the speed signals for accurate speed up the signals on routes that are mounted on boards PCB or boards laminated issues and new problems arises in the case of Field, gripped engineers will be events such as interference, distortion and noise and signal integrity at high frequencies cause to be subject to threats.

Sigrity 2022 software for simulation and signal integrity in high-frequency circuits. With the advancement of digital processing technology, the need for faster processing has grown increasingly, Prdzashgrhayy that necessarily needs to work faster circuits with higher processing speeds and higher frequencies are located. By increasing the speed signals for accurate speed up the signals on routes that are mounted on boards PCB or boards laminated issues and new problems arises in the case of Field, gripped engineers will be events such as interference, distortion and noise and signal integrity at high frequencies cause to be subject to threats.